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Electronics Cooling Module



Mentor Graphics’ Mechanical Analysis Division has been a leader in the simulation of airflow and temperature for the engineering community since 1989. 
With FloEFD’s concurrent CFD, software that connects directly with your CAD software, users can simulate airflow and heat transfer using 3D CAD models directly, with no need for data translations or copies.


More specifically the Electronics Cooling Module for FloEFD provides additional capabilities for analysis by specialists who support electronics cooling applications. Physical capabilities added to FloEFD are:


Joule Heating
FloEFD is able to calculate steady-state direct electric current in electroconductive solids:
  • The Joule heating effect is automatically calculated and included in heat transfer calculations
  • The calculations of electric potential and current are performed only in conductive solids, i.e. metals and metal-containing composite materials
  • The electrical resistivity of the material may be isotropic, anisotropic or temperature dependent




Compact Models
To allow for simulation of electronics equipment, the following compact models are offered in this module:
  • Two-resistor compact model
  • Mono-chip electronic packages
    • A defined junction-to-case resistance (Rjc) and a junction-to-board (Rjb) resistance
    • Two flat solid bodies representing the junction and case
    • They are test-based on an approved JEDEC standard
    • Built-in library of two-resistor models of standard JEDEC package outlines
    • Heat pipe compact model
  • Printed Circuit Board model including PCB generator







PCB Generator
To obtain the bi-axial thermal conductivity values, the following functionality is also available:
  • Normal (through plane) and in-plane thermal conductivities automatically derived from the PCB structure and the properties of the specified conductor and dielectric materials
  • The board can also be arbitrarily oriented with respect to the global coordinate system
    •  i.e. angled PCB’s can be modeled




Materials Library
In addition to the basic materials, the following are also included in this module:
  • More than 1000 fans from different fan manufacturers
  • Database of solids materials such as alloys, ceramics, metals, polymers, laminates, glasses and minerals, semiconductors
  • Database of IC packages
  • Database of single- and multi-stage Thermo-Electric Coolers (TEC)
  • Database of interface materials (contact thermal resistance)
  • Database of two-resistor components


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Flowmaster Korea,
2017. 7. 31. 오후 9:20