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Case Study & Paper

1D & 3D Direct Cosimulation, OneSim 을 활용한 Pump Header 유동해석 시연 및 기법소개

게시자: Songyi Han, 2019. 4. 9. 오후 5:55   [ 2019. 4. 9. 오후 5:55에 업데이트됨 ]

이번 자료는 Flowmaster Korea Conference 2019에서 발표된 내용으로 1D - 3D Co-Simulation 에서 발전 된(보다 빠르고 사용하기 편한) 기능인 OneSim 기능을 소개합니다.
그리고, Pump Header에서의 유량 불균형 현상을 OneSim 해석을 통해 System 측면의 고찰을 보다 정확하게 해석할 수 있음을 보여줍니다.



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FMI를 활용한 열유동 Co-Simulation(FloMASTER_Amesim_Matlab)

게시자: Songyi Han, 2019. 4. 9. 오후 5:50

이번 자료는 Flowmaster Korea Conference 2019에서 발표된 내용으로
Co-Simulation과 Model Exchange의 Standard로 자리잡은 FMI/FMU에 대한 소개와 그 활용 사례를 소개합니다.

  • Case Study - Thermal modeling of gasoline engine (FloMASTER - Amesim)
  • Case Study - ECS system and Cabin model (Multi FloMASTER Models - Matlab/Simulink)
  • Case Study - Aircraft Fuel System (FloMASTER - Amesim)






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Up, Up and Away!

게시자: Songyi Han, 2018. 10. 3. 오후 5:20


National Institute for Aviation Research (NIAR) of the Wichita State University aim to develop a way to increase the prediction accuracy of flight behaviors with the real-time flight simulator, MIURA. FloEFD was used by the NIAR team to conduct several simulations on their test model, in order to enhance their data to feed into the simulator for a better prediction of flight characteristics. Learn and understand how the simulator flight characteristics were improved with the help of CATIA V5 embedded FloEFD simulations.






▶ 분류 : Article
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A Cool Emulator - Component, PCB, Chassis to System Level

게시자: Songyi Han, 2018. 9. 27. 오후 4:40

Emulators, used in physical verification of SoC and Intellectual Property (IP)-based designs due to speed, have high heat dissipation requirements with tens of kWs in thermal energy from emulator’s boards and AC/DC power modules to remove. This article covers design factor and simulation studies for cooling of both the chip package, logic boards, board module sub-assemblies and emulator global system modeling level. FloTHERM suite software was used to detect unexpected physical behavior and optimize Veloce Emulator design. 

Topics include:
  • Compact thermal modeling of chip package for accurate Tj prediction
  • Power dissipation estimation for each key component 
  • Heatsink optimization in terms of efficiency, pressure drop vs changing layout
  • Optimizing temperature sensor positioning on PCB’s for fan operation and noise control
  • Chassis level airflow studies for configuration and fan positioning
  • System level analysis to check for dead areas or deleterious air recycling zones



▶ 분류 : Article
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Surge Analysis for Buoy Mooring Systems

게시자: Songyi Han, 2018. 9. 12. 오후 10:46


This paper will focus on the use of simulation to help engineers meet the fluid dynamics aspects in the design of a single buoy mooring system. More specifically, the example model presented shows how FloMASTER can be used to completely design the piping network taking into account not only proper piping diameters needed for the required throughput and loading times, but also accounting for the pressure transients that may compromise the integrity of the transfer lines and result in spillage of product into the environment.





▶ 분류 : Whitepaper
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2015 Don Miller Award Runner Up : Piping Afloat

게시자: Songyi Han, 2018. 9. 12. 오후 10:44

Morten Kjeldsen, Flow Design Bureau AS; and Christoffer Järpner, EnginSoft Nordic are the 2015 Don Miller award runners up. In their entry they discuss the use of Flowmaster combined with other CAE tools in order to optimize on-board piping systems for a Salt Ship Design. This article is a key example of how organisations can utilize Flowmaster to speed up their design process alongside optimizing systems for operational and failure scenarios.



▶ 분류 : Article
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Three Thermal Simulation & Test Innovations for Electronics Equipment Design

게시자: Songyi Han, 2018. 8. 30. 오후 6:02

Over the last 50 years the automotive industry has been going through huge shifts in electrification (Figure 1). And, of course, we are seeing the electric motor starting to replace the mechanical engine with the advent of Electric & Hybrid Vehicles. Not surprisingly, the demand for ever higher density in a confined electronics, leads to a greater and greater need to resolve the resultant thermal issues.






▶ 분류 : Article
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Reliability Evaluation of Sintered Copper Die Bonding Materials

게시자: Songyi Han, 2018. 8. 30. 오후 6:00

Hitachi Chemical is one of the group of companies of Hitachi Ltd and we have about 19,000 employees with annual revenues of ~$5Bn/yr. About 50% of our business is in materials manufacture and 50% is in the application of these materials to a wide range of devices and systems, including applications in the automotive, life sciences, environmental and energy sectors. Materials products we make include epoxy moldings for semiconductors, die bonding materials, polishing materials for semiconductor circuits, varnish for electrical insulation, and carbon anodes for Lithium Ion batteries plus other carbon products.








▶ 분류 : Article
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Thermal Power - Envelopes in IOT Solutions

게시자: Songyi Han, 2018. 8. 30. 오후 5:58


Intel’s Internet of Things Group (IOTG) comprises a variety of divisions Retail Solutions, Smart Home/Building, Industrial Solutions and Transportation to name a few. Each division has its own challenges when it comes to designing solutions for their customers. The Thermal/Mechanical Systems Engineering team within IOTG is there to ensure that the solutions are designed with adequate thermal capabilities for the Intel processor within them.






▶ 분류 : Article
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Rapid Beverage Cooling Analysis in FloTHERM XT

게시자: Songyi Han, 2018. 8. 30. 오후 5:55


There is an increasing market for appliances that are designed to cool beverages 
many times faster than a conventional refrigeration approach. When the liquid is prepackaged in a can or bottle, there are cooling approaches that aren’t possible when cooling items of arbitrary shapes and sizes. The same is true for beverage coolers that are designed with an integrated barrel or tank for the liquid as shown in Figure 1.





▶ 분류 : Article
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