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A Cool Emulator - Component, PCB, Chassis to System Level

posted Sep 27, 2018, 4:40 PM by Songyi Han
Emulators, used in physical verification of SoC and Intellectual Property (IP)-based designs due to speed, have high heat dissipation requirements with tens of kWs in thermal energy from emulator’s boards and AC/DC power modules to remove. This article covers design factor and simulation studies for cooling of both the chip package, logic boards, board module sub-assemblies and emulator global system modeling level. FloTHERM suite software was used to detect unexpected physical behavior and optimize Veloce Emulator design. 

Topics include:
  • Compact thermal modeling of chip package for accurate Tj prediction
  • Power dissipation estimation for each key component 
  • Heatsink optimization in terms of efficiency, pressure drop vs changing layout
  • Optimizing temperature sensor positioning on PCB’s for fan operation and noise control
  • Chassis level airflow studies for configuration and fan positioning
  • System level analysis to check for dead areas or deleterious air recycling zones



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