Emulators, used in physical verification of SoC and Intellectual Property (IP)-based designs due to speed, have high heat dissipation requirements with tens of kWs in thermal energy from emulator’s boards and AC/DC power modules to remove. This article covers design factor and simulation studies for cooling of both the chip package, logic boards, board module sub-assemblies and emulator global system modeling level. FloTHERM suite software was used to detect unexpected physical behavior and optimize Veloce Emulator design. Topics include:
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