게시자: Songyi Han, 2018. 9. 27. 오후 4:40
Emulators, used in physical verification of SoC and Intellectual Property (IP)-based designs due to speed, have high heat dissipation requirements with tens of kWs in thermal energy from emulator’s boards and AC/DC power modules to remove. This article covers design factor and simulation studies for cooling of both the chip package, logic boards, board module sub-assemblies and emulator global system modeling level. FloTHERM suite software was used to detect unexpected physical behavior and optimize Veloce Emulator design.
Topics include: - Compact thermal modeling of chip package for accurate Tj prediction
- Power dissipation estimation for each key component
- Heatsink optimization in terms of efficiency, pressure drop vs changing layout
- Optimizing temperature sensor positioning on PCB’s for fan operation and noise control
- Chassis level airflow studies for configuration and fan positioning
- System level analysis to check for dead areas or deleterious air recycling zones
|
|
