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Consumer Electronics Miniaturization : Thermal Analysis of a Small Outline Package Mounted on a PCB Using Computational Fluid Dynamics

posted Aug 30, 2018, 5:53 PM by Songyi Han
The trend towards miniaturization in the consumer electronics industry has driven package component sizes down to the design-rule level of early technologies. Crucial in integrated circuit (IC) package technology is that it must deliver higher lead counts, reduced lead pitch, minimum footprint area, and significant volume reduction.
As a result, this has led to semiconductor manufacturers developing the small outline package (SOP), surface-mount memory packaging.


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