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Dynamic Compact Thermal Model Development within ROHM Semiconductor

posted May 31, 2018, 5:57 PM by Songyi Han

It is commonly accepted that two of the trends in the electronics industry are miniaturization and the electrification of all things. As a result electronics today are deployed into dynamic and sometimes harsh environments. As the environments have changed, so have the requirements for the system integrators. Today, companies need IC package models that can accurately predict dynamic thermal performance.


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