## Simcenter FLOEFD 2306

Model the complexity

## Electronics – Thermal Analysis

### ▷ IGBT compact model

Challenge

Predict junction temperature of an electrical element with a heat source determined by a non-linear Current–Voltage characteristic :

Thermal model – 2R component

Heat source – electrical power

Current–Voltage characteristic – series of non-linear curves for different temperature values

Solution

IGBT compact model as a composition of Electrical Element and 2R component compact models

Input

R ( junction to bottom)

R ( junction to top)

Voltage or Current

Output

Junction Temperature

Convenient implementation of electronic component

how it works

Junction temperature is used for Electrical Power determination from I-V chart

Resulting Electrical Power is applied to the model through the 2R component

IGBT compact model

### ▷Reference temperature for BCI-ROM extraction

Challenge

Prior BCI-ROM does not allow the use of materials with temperature dependent properties, so customer needs to substitute all dependencies with constant values. This procedure can be time consuming

Solution

Use reference temperature to obtain constant values from dependencies automatically for all materials

Update to the latest BCI-ROM version

Simplify project definition for BCI-ROM extraction

### ▷Component Explorer Export and import of a component list

Challenge

Manage large volume of component materials and properties through Excel spreadsheet

Solution

Ability to export and import a component list from the Component Explorer dialog

Component materials

Heat source and 2R power

LED current

Convenient management of component attributes

Component properties can be exported into an Excel spreadsheet then edited and imported back.

The order of the components in the exported list follows the original designer’s hierarchy.

Properties available for editing :

Component Material

Volume source value

2R (instance from the library and power)

LED (instance from the library and current)

## Electronics – Multiphysics

### ▷SC3D NASTRAN non-linear solver connection

Challenge

Many structural analysis applications of interest in electronics require non-linear solver capabilities

Solution

Connect Simcenter FLOEFD with Simcenter 3D Nastran solver to access its non-linear functionality

Leverage existing solutions in Simcenter portfolio

Initial step to exploring further application areas

SC3D Nastran solver 401 is used for Nonlinear analysis

SC3D Nastran should be installed and licensed independently

Expand range of structural analysis applications

Connection with the Simcenter 3D Nastran solver opens its non-linear capabilities to users from their familiar Simcenter FLOEFD interface :

Set up project, run solver and process results as usual.

SC3D Nastran solves Smart PCB with all nets for both levels of detail (fine and homogenized).

Easier design space exploration by working with one model

### ▷Structural : Large displacement

Challenge

Take into account structural non-linear behavior due to large displacement of geometry

Solution

Use Simcenter Nastran non-linear capabilities of iterative solver 401

Analyze cases with large displacement

### ▷Structural : Tolerance based contacts

Challenge

Create contacts on surfaces of overlapping bodies or bodies with the gaps between them in preparation for structural analysis.

Solution

Tolerance based contacts: ability to specify tolerances and use them to create contacts between bodies with gaps

Linear and angle tolerances for contacts

Glue contact between bodies with gap

Improved options for contact definition

Example of a tolerance-based contact with non-ideal geometry of a ball joint with overlapping areas and regions with gaps

### ▷Structural : User defined maximum aspect ratio in local mesh

Challenge

Create HEX dominant mesh for thin plates with high aspect ratio value, beyond the limitation of 1:4

Solution

Allow user to specify maximum aspect ratio for particular components in the Structural mesh settings dialog

Increased meshing efficiency for handling thin components

### ▷Structural : Goals for frequency analysis

Challenge

Obtain eigenvalues of a frequency analysis as a goal function of a calculation, be able to conduct parametric study or optimization

Solution

add goals for frequencies

Modal frequency parametrization

with frequency values as goal functions